Combining radial basis function neural network and genetic algorithm to improve HDD driver IC chip scale package assembly yield

摘要

In recent years, the future trend of micro HDD driver IC for large capacity micro HDD is to become lighter, thinner, shorter and smaller. Among all the options available for micro HDD driver IC’s assembly, warpage is an important issue related to micro HDD driver IC manufacturability and reliability. The optimal packaging manufacturing process for driver IC for micro HDD is chip scale package (CSP). However, the production and assemble process for CSP is much more difficult. The aim of this study is to improve the lower warpage properties for 0.65 mm CSP assembly yield using a model based on a radial basis function network (RBFN), and the optimal HDD packaging process parameter design is achieved through a genetic algorithm (GA).