Active neural network control of wafer attributes in a plasma etch process : Frye Robert; Harry Thomas R; Lory Earl R; Rietman Edward A Piscataway, NJ, UNITED STATES assigned to AT&T Corp
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论文评审过程：Available online 11 June 1999.
论文官网地址：https://doi.org/10.1016/0957-4174(96)84821-4
