Wafer map failure pattern recognition based on deep convolutional neural network

作者：

Highlights：

• The systematic failure pattern recognition method for wafer map is explored.

• A deep convolutional neural network model is established.

• This model is an end-to-end 19-layer network structure.

• This model can automatically extract effective classification features.

• The mode can enhance the reliability and efficiency of fault pattern recognition.

摘要

•The systematic failure pattern recognition method for wafer map is explored.•A deep convolutional neural network model is established.•This model is an end-to-end 19-layer network structure.•This model can automatically extract effective classification features.•The mode can enhance the reliability and efficiency of fault pattern recognition.

论文关键词：Wafer map,Pattern recognition,Deep convolutional neural networks (DCNN),Information entropy fusion

论文评审过程：Received 29 April 2021, Revised 3 July 2022, Accepted 20 July 2022, Available online 23 July 2022, Version of Record 3 August 2022.

论文官网地址：https://doi.org/10.1016/j.eswa.2022.118254