An unconditionally stable finite difference scheme for solving a 3D heat transport equation in a sub-microscale thin film

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摘要

Heat transport at the microscale is of vital importance in microtechnology applications. The heat transport equation is different from the traditional heat diffusion equation since a second-order derivative of temperature with respect to time and a third-order mixed derivative of temperature with respect to space and time are introduced. In this study, we develop a finite difference scheme with two levels in time for the 3D heat transport equation in a sub-microscale thin film. It is shown by the discrete energy method that the scheme is unconditionally stable. The 3D implicit scheme is then solved by using a preconditioned Richardson iteration, so that only a tridiagonal linear system is solved for each iteration. The numerical procedure is employed to obtain the temperature rise in a gold sub-microscale thin film.

论文关键词:Finite difference,Stability,Heat transport equation,Thin film,Microscale

论文评审过程:Received 7 December 2000, Revised 25 August 2001, Available online 27 November 2001.

论文官网地址:https://doi.org/10.1016/S0377-0427(01)00579-9